BGA Reball Stencil Solder Tin Plate for iPhone 6 6S 7 8 / Plus X XR XS / Max 11 / Pro / Max #AMAOE
$4.99
Ask for a tailored price, mixed-model pricing or a freight quote for this item. Enquiries answered within 24 hours.
- Description
- Additional information
- Reviews (0)
Description
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iPhone 5/5C/5S -A6/A7 T=0.12MM
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iPhone 11/Pro/Max – A13 T=0.12MM
|
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iPhone 6/6P – A8 T=0.12MM |
iPhone 6/6P [no CPU] T=0.12MM |
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iPhone 6S/6SP – A9 T=0.12MM |
iPhone 6S/6SP [no CPU] T=0.12MM |
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iPhone 7/7P – A10 T=0.12MM |
iPhone 7/7P [no CPU] T=0.12MM |
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iPhone X/8/8P – A11 T=0.12MM |
iPhone X/8/8P [no CPU] T=0.12MM |
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iPhone XS/XS Max/XR – A12 T=0.12MM |
iPhone XS/XS Max/XR [no CPU] T=0.12MM |
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iPhone X Mid-Mainboard BGA T=0.10MM |
iPhone X Mid-Mainboard BGA T=0.12MM |
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iPhone X Mid-Mainboard+Hard disk T=0.15MM |
iPhone XS/Max Mid-Mainboard BGA T=0.10MM |
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iPhone XS/Max Mid-Mainboard BGA T=0.12MM |
iPhone XS/Max Mid-Mainboard+Hard disk T=0.15MM |
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iPhone 11 Mid-Mainboard BGA T=0.10MM |
iPhone 11 Mid-Mainboard BGA T=0.12MM |
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iPhone 11 Mid-Mainboard BGA T=0.15MM |
iPhone 11Pro/Max Mid-Mainboard BGA T=0.10MM |
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iPhone 11Pro/Max Mid-Mainboard BGA T=0.12MM |
iPhone 11Pro/Max Mid-Mainboard BGA T=0.15MM |
Additional information
| Weight | 0.008 kg |
|---|---|
| AMAOE_ipMODEL | iPhone 5/5C/5S -A6/A7 T=0.12MM, iPhone 6/6P [no CPU] T=0.12MM, iPhone 6/6P – A8 T=0.12MM, iPhone 6S/6SP [no CPU] T=0.12MM, iPhone 6S/6SP – A9 T=0.12MM, iPhone 7/7P [no CPU] T=0.12MM, iPhone 7/7P – A10 T=0.12MM, iPhone X/8/8P [no CPU] T=0.12MM, iPhone X/8/8P – A11 T=0.12MM, iPhone XS/XS Max/XR [no CPU] T=0.12MM, iPhone XS/XS Max/XR – A12 T=0.12MM, iPhone 11/Pro/Max – A13 T=0.12MM, iPhone X Mid-Mainboard BGA T=0.10MM, iPhone X Mid-Mainboard BGA T=0.12MM, iPhone X Mid-Mainboard+Hard disk T=0.15MM, iPhone XS/Max Mid-Mainboard BGA T=0.10MM, iPhone XS/Max Mid-Mainboard BGA T=0.12MM, iPhone XS/Max Mid-Mainboard+Hard disk T=0.15MM, iPhone 11 Mid-Mainboard BGA T=0.10MM, iPhone 11 Mid-Mainboard BGA T=0.12MM, iPhone 11 Mid-Mainboard BGA T=0.15MM, iPhone 11Pro/Max Mid-Mainboard BGA T=0.10MM, iPhone 11Pro/Max Mainboard BGA T=0.12MM, iPhone 11Pro/Max Mainboard BGA T=0.15MM |
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Wholesale Terms
Standard trading terms for this item. Larger quantity or special requirements? We quote case by case.
- MOQ
- 10 pcs per model. Mixed models welcome to reach one export carton.
- Lead time
- 1-3 business days for in-stock items
- Packaging
- Anti-static bag + foam insert + export carton. Vacuum sealed on request.
- Quality & warranty
- Every piece inspected before dispatch. See the warranty and returns policy.
- Payment terms
- PayPal · T/T bank transfer · L/C at sight for container orders. Credit terms available for repeat buyers.
- Shipping
- Worldwide from Shenzhen by express courier (DHL, FedEx, UPS) or sea freight for machines. Ask for a freight quote.
Exporting since 2010 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
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