-78%
BGA Reballing Stencil AMAOE EMMC3 BGA Reballing Stencil for Android Nand Flash EMMC EMCP UFS LPDDR PCIE 153 162 169 200 221 254 60 70 186 200 Tin Net
Original price was: $6.55.$1.47Current price is: $1.47.
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SKU 12000026063287813
Ask for a tailored price, mixed-model pricing or a freight quote for this item. Enquiries answered within 24 hours.
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- Description
- Reviews (0)
Description
Specifications:
– Model Number: Universal Solder Paste Template
– Type: Hand Tool Parts
– Use: Commercial Manufacture
– Material: Stainless Steel
– Origin: Mainland China
– High-concerned chemical: none
– is_customized: No
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Wholesale Terms
Standard trading terms for this item. Larger quantity or special requirements? We quote case by case.
- MOQ
- 10 pcs per model. Mixed models welcome to reach one export carton.
- Lead time
- 1-3 business days for in-stock items
- Packaging
- Anti-static bag + foam insert + export carton. Vacuum sealed on request.
- Quality & warranty
- Every piece inspected before dispatch. See the warranty and returns policy.
- Payment terms
- PayPal · T/T bank transfer · L/C at sight for container orders. Credit terms available for repeat buyers.
- Shipping
- Worldwide from Shenzhen by express courier (DHL, FedEx, UPS) or sea freight for machines. Ask for a freight quote.
Xicart · Shenzhen Jiexinhui Technology Co., Ltd.
Exporting since 2012 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
Ask about bulk pricing
Exporting since 2012 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
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