3D BGA Reball Stencil Kits A8 A9 A10 A11 A12 A13 Solder tin plate for iPhone 3D BGA planting Stencil
$9.98
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SKU JX0966-2
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Description
3D BGA Reball Stencil Kits A8 A9 A10 Solder tin plate for iPhone 3D BGA planting Stencil
Additional information
| Weight | 0.055 kg |
|---|
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Wholesale Terms
Standard trading terms for this item. Larger quantity or special requirements? We quote case by case.
- MOQ
- 10 pcs per model. Mixed models welcome to reach one export carton.
- Lead time
- 1-3 business days for in-stock items
- Packaging
- Anti-static bag + foam insert + export carton. Vacuum sealed on request.
- Quality & warranty
- Every piece inspected before dispatch. See the warranty and returns policy.
- Payment terms
- PayPal · T/T bank transfer · L/C at sight for container orders. Credit terms available for repeat buyers.
- Shipping
- Worldwide from Shenzhen by express courier (DHL, FedEx, UPS) or sea freight for machines. Ask for a freight quote.
Xicart · Shenzhen Jiexinhui Technology Co., Ltd.
Exporting since 2010 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
Ask about bulk pricing
Exporting since 2010 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
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