Qianli BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Tin Planting Soldering Template
$5.30
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SKU JX9898
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Description
Qianli BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Tin Planting Soldering Template
–High Quality Steel Reballing Stencil.
–Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR.
–Specially Designed for iPhone 11/11Pro/11Pro Max/12/12Pro/12Pro Max/12Mini/13/13Pro/13Pro Max.
–Make your repair work easier.
–Material : Steel
–Feature : Square Hole
–We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.
Additional information
| Weight | 0.03 kg |
|---|
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Wholesale Terms
Standard trading terms for this item. Larger quantity or special requirements? We quote case by case.
- MOQ
- 10 pcs per model. Mixed models welcome to reach one export carton.
- Lead time
- 1-3 business days for in-stock items
- Packaging
- Anti-static bag + foam insert + export carton. Vacuum sealed on request.
- Quality & warranty
- Every piece inspected before dispatch. See the warranty and returns policy.
- Payment terms
- PayPal · T/T bank transfer · L/C at sight for container orders. Credit terms available for repeat buyers.
- Shipping
- Worldwide from Shenzhen by express courier (DHL, FedEx, UPS) or sea freight for machines. Ask for a freight quote.
Xicart · Shenzhen Jiexinhui Technology Co., Ltd.
Exporting since 2010 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
Ask about bulk pricing
Exporting since 2010 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
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