Description

Qianli BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Tin Planting Soldering Template

–High Quality Steel Reballing Stencil.
–Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR.
–Specially Designed for iPhone 11/11Pro/11Pro Max/12/12Pro/12Pro Max/12Mini/13/13Pro/13Pro Max.
–Make your repair work easier.
–Material : Steel
–Feature : Square Hole
–We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

Additional information

Weight 0.030000 kg

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