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BGA reballing stencil Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
Original price was: $6.49.$1.47Current price is: $1.47.
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SKU 10000010477669609
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- Description
- Reviews (0)
Description
Specifications:
– Thickness: 0.12MM
– Model Number: Amaoe BGA Reballing Stencil
– Type: Other
– Use: Commercial Manufacture
– Material: Stainless Steel
– Origin: Mainland China
– High-concerned chemical: none
– is_customized: No
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Wholesale Terms
Standard trading terms for this item. Larger quantity or special requirements? We quote case by case.
- MOQ
- 10 pcs per model. Mixed models welcome to reach one export carton.
- Lead time
- 1-3 business days for in-stock items
- Packaging
- Anti-static bag + foam insert + export carton. Vacuum sealed on request.
- Quality & warranty
- Every piece inspected before dispatch. See the warranty and returns policy.
- Payment terms
- PayPal · T/T bank transfer · L/C at sight for container orders. Credit terms available for repeat buyers.
- Shipping
- Worldwide from Shenzhen by express courier (DHL, FedEx, UPS) or sea freight for machines. Ask for a freight quote.
Xicart · Shenzhen Jiexinhui Technology Co., Ltd.
Exporting since 2012 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
Ask about bulk pricing
Exporting since 2012 · Business hours Mon - Sun, 9:00 AM - 10:00 PM (GMT+8, Beijing Time)
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