QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 1
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 2
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 3
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 4
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 5
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 6
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 7
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 8
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 9
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 10
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 11
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 12
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 13
QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet - Image 14

QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet

Qianli 011Multifunctioal CPU IC Glue Remover Knife Thin blade motherboard BGA chip glue Cleaning Scraping Pry
Qianli Universal Square Hole Power Logic Module Black Reball Stencil for iPhone 8 7 6s 6 5 5s Plus Japan imported steel mesh
0 out of 5
( There are no reviews yet. )

$6.91

Availability: 72 in stock SKU: JX1490 Categories: , , , , , , , , , , , , ,

Description

Additional information

Weight 0.020000 kg

Reviews

There are no reviews yet.

Be the first to review “QIANLI iBlack Plus Steel Mesh NAND Baseband IC / CPU A8 A9 A10 A11 A12 BGA Reballing Stencil for IPHONE 6 6S 7 7P 8P X XS/Max 11/Pro/Max T0.12mmnet”