工艺参数:
贴盖板:温度50℃,压力0.5mpa,抽真空35s,保压30s;
脱 泡:温度60℃,压力0.6mpa,保压25分钟;
贴总成:温度50℃,压力0.5mpa,抽真空27s,保压30s;
脱 泡:温度60℃,压力0.6mpa,保压25分钟;
U V:3000mj,30分钟,温度60℃。
以上参数需要根据不同设备调整,若有相关咨询,请联系售后技术人员。
process parameters:
Cover plate sticking: temperature 50 ℃, pressure 0.5MPa, vacuum 35 s, pressure 30 s;
Defoaming: temperature 60 ℃, pressure 0.6MPa, pressure 25 minutes;
Assembly: temperature 50 ℃, pressure 0.5MPa, vacuum 27s, pressure 30s;
Defoaming: temperature 60 ℃, pressure 0.6MPa, pressure 25 minutes;
U V: 3000mj, 30 minutes, temperature 60 ℃.
The above parameters need to be adjusted according to different equipment. Please contact after-sales technical personnel if there is any consultation.