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3D BGA Reball Stencil Kits A8 A9 A10 Solder tin plate for iPhone 3D BGA planting Stencil

3D BGA Reball Stencil Kits A8 A9 A10 A11 A12 A13 Solder tin plate for iPhone 3D BGA planting Stencil

BGA Reball Stencil Solder tin plate for Samsung

BGA Reball Stencil Solder tin plate for Samsung Exynos8895 / MSM8998 CPU Samsung S8/S8+/Note8 G9500/G955U/N9500 T=0.12MM # AMAOE SAM1

BGA Reball Stencil Solder Tin Plate for iPhone 6 6S 7 8 / Plus X XR XS / Max 11 / Pro / Max #AMAOE

As low as $4.99
Availability: In stock
SKU
JX0966-3

iPhone 5/5C/5S -A6/A7 T=0.12MM

iPhone 11/Pro/Max - A13 T=0.12MM

 

iPhone 6/6P - A8 T=0.12MM

iPhone 6/6P [no CPU] T=0.12MM

iPhone 6S/6SP - A9 T=0.12MM

iPhone 6S/6SP [no CPU] T=0.12MM

iPhone 7/7P - A10 T=0.12MM

iPhone 7/7P [no CPU] T=0.12MM

iPhone X/8/8P - A11 T=0.12MM

iPhone X/8/8P [no CPU] T=0.12MM

iPhone XS/XS Max/XR - A12 T=0.12MM

iPhone XS/XS Max/XR [no CPU] T=0.12MM

iPhone X Mid-Mainboard BGA T=0.10MM

iPhone X Mid-Mainboard BGA T=0.12MM

iPhone X Mid-Mainboard+Hard disk T=0.15MM

iPhone XS/Max Mid-Mainboard BGA T=0.10MM

iPhone XS/Max Mid-Mainboard BGA T=0.12MM

iPhone XS/Max Mid-Mainboard+Hard disk T=0.15MM

iPhone 11 Mid-Mainboard BGA T=0.10MM

iPhone 11 Mid-Mainboard BGA T=0.12MM

iPhone 11 Mid-Mainboard BGA T=0.15MM

iPhone 11Pro/Max Mid-Mainboard BGA T=0.10MM

iPhone 11Pro/Max Mid-Mainboard BGA T=0.12MM

iPhone 11Pro/Max Mid-Mainboard BGA T=0.15MM